|
Layer 16 works with a variety of Fabrication and Assembly houses to provide the customer with quality, schedule, and pricing for designs done at Layer 16. While we don't fabricate or assemble boards ourselves, we do stand behind the work of the vendors we use. Each of our vendors has gone through a rigorous selection process, and provides only the highest quality services. We work closely with the fabrication and assembly houses on every design we do. This Design For Manufacture process works well to ensure that all designs leaving Layer 16 are easy to manufacture, and easy to assemble.
Procurment:
- RoHS component guidance
- Cost Reductions
- Component Kitting
- Supply Chain Management
Fabrication:
- Multi Layer up to 24 Layers
- Buried Via Technology & Blind Via Technology
- Micro Via Technology
- Flexi Rigid Circuits & Flexi Circuits
- Backplanes
- Controlled / Differential Impedance
- Bonded Heat Sinks
- Excotic Materials
- Far Eastern Manufacture
Assembly:
- State-of-the-art assembly equipment
- Single and double-sided SMT processes
- Chip component size down to 0402
- Fine and ultra fine pitch components
- Ball Grid Array with X-ray laminography
- Board thickness from .018" to 0.2"
- Board size up to 18" x 20"
- Device Programming
Quality:
- In-Circuit Test
- Functional Test
- Power Elextronics Test Experience
- Understanding of Networking/Datacom/Otptical test requirements
|
